Post Time｜2021/1/13
Responsibilities｜
- Packaging/assembly Development Engineer for power IC (MOSFETs)
- Package design and assembly process development in co operation with supplier.
- Developing solutions for assembly processes for power application.
- Coordination of sample manufacturing at assembly partner.
- Team work in English language with a multitude of international interfaces is mandatory.
Requirements｜
- 5+ years’ experience in packaging/assembly of semiconductors including power
semiconduct ors (MOSFETs, IGBTS) - Solid technical background in backend packaging assembly technolo gy
- Experience with SMT or QFN packaging is a plus
- Passion for developing technical solutions in multidisciplinary international projects
- Very good English skills
- Ability to travel
Others｜
- Can work from home if certain conditions are met.
