半導體設備商 製程工程師 / 機械工程師

Company Overview

Our client is a national-level high-tech semiconductor equipment company focused on advanced wet process and electroplating equipment for integrated circuit manufacturing and advanced packaging.
The company develops and manufactures core front-end and BEOL equipment, including vertical electroplating and cleaning systems, supporting leading-edge semiconductor fabs. Its products are positioned at the forefront of critical equipment localization and high-end process replacement, serving customers in both logic and advanced packaging segments.
Engineers joining this team play a key role in bridging equipment development and fab-level mass production, with strong exposure to customer-side problem solving, next-generation process development, and direct influence on product competitiveness.

Job Summary

This role focuses on the company’s core product line — vertical copper electroplating equipment for semiconductor wafer manufacturing.
You will act as a process and equipment expert, responsible for process development, customer-side technical support, defect analysis, and continuous optimization. The goal is to ensure stable, high-performance operation of electroplating tools in customer fabs, supporting product adoption in high-end semiconductor manufacturing.
This position offers strong technical depth, high customer visibility, and long-term growth toward principal engineer, technical expert, or platform-level leadership roles.

Responsibilities

• Lead process development and optimization for vertical copper electroplating equipment, including recipe tuning and standard process menu definition.
• Optimize electroplating uniformity, defect control, and throughput to meet high-volume manufacturing requirements.
• Provide on-site technical support at customer fabs, including tool installation, process qualification, acceptance, and mass production ramp support.
• Lead analysis and resolution of electroplating-related defects such as voids, nodules, thickness non-uniformity, and surface abnormalities.
• Perform root cause analysis and drive corrective and preventive actions for process and equipment issues.
• Work closely with R&D teams to feedback customer-side issues, participate in next-generation tool design reviews, and define process-related requirements.
• Collaborate with sales and marketing teams to support technical discussions, customer demos, and process capability presentations.
• Prepare detailed process documentation, troubleshooting reports, and best-practice guidelines.
• Deliver internal and customer-facing training on tool operation, process control, and optimization.
• Track and analyze technology trends of leading international competitors (e.g., Applied Materials, Ebara) in vertical electroplating equipment.

Requirements

• Bachelor’s degree or above in Microelectronics, Materials Science, Chemical Engineering, Mechanical Engineering, Physics, or related fields.
• 3+ years of experience in the semiconductor industry, with one or more of the following backgrounds:
  • Fab-side experience in Thin Film, Plating, or Wet process modules, with hands-on exposure to copper damascene processes.
  • International semiconductor equipment company experience, supporting electroplating tools or wet process equipment.
• Solid understanding of electrochemical principles, copper electroplating mechanisms, and additive chemistry.
• Familiarity with front-end semiconductor manufacturing flow, especially copper interconnect processes.
• Knowledge of semiconductor equipment automation, including SECS/GEM communication and fab facility systems (UPW, exhaust, chemical delivery).
• Ability to work independently at customer sites and handle complex technical issues.
• Willingness to travel to customer fabs as required.

Qualifications

• Proven experience leading electroplating tools from installation through mass production at customer fabs.
• Deep understanding of PVD/CVD thin film processes related to copper interconnect.
• Experience working directly with high-volume logic or advanced packaging fabs.
• Strong technical communication skills for customer-facing engagements.

Post Time｜2026/02/10