Summary
Etched is hiring a Manufacturing Test Engineer based in Taiwan to own development, deployment, and sustainment of manufacturing test solutions at our L10 contract manufacturer. You will serve as the primary in-region technical lead for test strategy and execution, ensuring robust and scalable test processes across PCBA, subsystems, and full server-level builds. This role requires deep technical expertise and hands-on engagement with CM partners to ensure high yield, quality, and reliability as we ramp into production.
Responsibilities
- Develop and validate manufacturing test plans, fixtures, and automated test systems across board, subsystem, and server levels.
- Collaborate with design, packaging, and reliability engineering to define test requirements and ensure sufficient coverage.
- Ensure test infrastructure readiness to support production ramp.
- Qualify test process readiness at CM to ensure sufficient test coverage and optimized test time.
- Monitor test metrics including yield, throughput, and false failure rates; drive continuous improvement.
- Lead root cause analysis and corrective action for test escapes, yield issues, and reliability failures.
- Partner with CM engineering teams on NPI builds, MP ramps, and process change control.
- Provide DFT (Design for Testability) feedback to internal design teams for next-generation products.
- Ensure test solutions are scalable, maintainable, and compliant with reliability and quality standards.
- Act as the primary technical interface for all test-related topics between Etched HQ and L10 in Taiwan.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
- 7+ years of experience in manufacturing test engineering for complex hardware systems (servers, networking, or semiconductor-based).
- Strong background in test development for PCBA, HBM/memory, power delivery, and system-level validation.
- Proficiency in automated test systems, scripting (Python, LabVIEW, or similar), and test data analysis.
- Hands-on experience with ICT, functional test, and high-volume test strategy.
- Prior experience working directly with Taiwan-based contract manufacturers (L6-level preferred).
- Fluent in Mandarin and English, with strong communication and technical documentation skills.
- Ability to travel within Taiwan and occasionally internationally.
Preferred Qualifications
- Experience supporting NPI to MP ramp in AI ASIC or high-performance server systems.
- Familiarity with HBM memory test, probe card design, and socket qualification.
- Prior exposure to reliability testing and failure analysis workflows.
- Background in startup or hypergrowth hardware environments with high ownership.
Post Time｜2025/12/05
