Company Overview
Our client is a fast-growing US consumer technology company developing a new generation of premium connected devices.
The company first gained recognition through its imaging products and is now expanding beyond cameras into a broader portfolio of consumer hardware. Backed by leading technology investors, it is entering its next stage of growth with multiple new products under development.
As the company expands its hardware development and manufacturing presence in Asia, Taiwan will play an increasingly important role. This position will be the first TPM hire in Taiwan, with the opportunity to help build local engineering processes, supplier relationships, and future product execution.
Job Summary
We are looking for a hands-on Technical Program Manager with a strong engineering background to lead hardware development programs from early concept through mass production.
As the first TPM based in Taiwan, you will play a highly visible and independent role, representing the company locally across ODMs, suppliers, engineering partners, and manufacturing teams.
This is not a traditional schedule-tracking PM position.
The ideal candidate understands how consumer hardware is actually developed, can engage deeply with engineers on technical issues, identify risks before they become schedule problems, and drive cross-functional teams through fast-paced development cycles.
You will work closely with Electrical Engineering, Mechanical Engineering, Firmware, Industrial Design, Operations, Quality, and manufacturing partners to transform early concepts into reliable, high-quality products ready for global launch.
Responsibilities
- Own hardware development programs from early prototype and architecture definition through EVT, DVT, PVT, ramp, and mass production.
- Serve as the primary Taiwan-based interface between US headquarters, ODM partners, contract manufacturers, suppliers, and local engineering teams.
- Drive program schedules, milestones, deliverables, dependencies, and critical-path execution across engineering and manufacturing functions.
- Work closely with EE, ME, Firmware, Software, ID, Reliability, Quality, and Operations teams to identify and resolve cross-functional issues.
- Participate deeply in technical discussions and understand engineering trade-offs rather than simply tracking action items.
- Identify technical, supply-chain, manufacturing, and schedule risks early and drive mitigation plans to closure.
- Lead regular program reviews, engineering discussions, build-readiness reviews, and issue-tracking meetings.
- Drive prototype and engineering builds, including build preparation, material readiness, issue prioritization, and post-build analysis.
- Manage EVT, DVT, and PVT exit criteria and ensure critical technical risks are resolved before progressing to the next development phase.
- Coordinate validation activities covering product functionality, reliability, performance, safety, and manufacturing readiness.
- Partner with ODM and supplier engineering teams to resolve electrical, mechanical, firmware, tooling, process, and component-related issues.
- Drive failure analysis and root-cause resolution for issues discovered during engineering builds and validation.
- Track engineering changes, BOM readiness, design changes, and manufacturing dependencies.
- Support component selection, supplier engagement, tooling, qualification, and manufacturing-readiness activities.
- Communicate program status, major risks, technical decisions, and escalation items clearly to US leadership.
- Establish effective development processes and communication mechanisms for the company’s growing Taiwan operation.
- Act as the local technical and operational owner when headquarters teams are not physically present.
Requirements
- Bachelor’s degree or above in Electrical Engineering, Mechanical Engineering, Computer Engineering, or another relevant engineering discipline.
- 7+ years of experience in consumer electronics, hardware development, technical program management, product engineering, or related roles.
- Strong engineering foundation with prior hands-on experience in hardware product development.
- Experience taking consumer hardware products through EVT, DVT, PVT, and mass production.
- Strong understanding of hardware development processes, engineering validation, manufacturing, and NPI.
- Ability to understand and discuss technical issues across EE, ME, Firmware, system integration, and manufacturing.
- Experience working directly with ODMs, contract manufacturers, component suppliers, or tooling vendors in Asia.
- Strong program-management skills, including schedule management, risk management, dependency tracking, and issue closure.
- Demonstrated ability to independently drive complex programs with limited local supervision.
- Strong problem-solving ability and comfort operating in ambiguous, fast-changing environments.
- Excellent communication and stakeholder-management skills.
- Professional working proficiency in both English and Mandarin.
- Ability to communicate directly with US engineering and leadership teams.
Preferred Qualifications
- Previous experience as an Electrical Engineer, Mechanical Engineer, Hardware Engineer, Systems Engineer, or Product Engineer before transitioning into TPM / Program Management.
- Experience developing cameras, imaging products, smart-home devices, wearables, audio products, or other highly integrated consumer electronics.
- Familiarity with camera systems, image sensors, optics, USB, power architecture, wireless connectivity, embedded systems, or high-speed interfaces.
- Strong understanding of DFM, DFA, DFT, reliability validation, and manufacturing-test strategy.
- Experience managing complex mechanical tooling, PCB development, firmware readiness, and system integration within the same program.
- Experience working in startup or high-growth consumer hardware environments.
- Experience establishing a new local engineering or program-management function in Taiwan.
- Familiarity with BOM management, RFQ, cost tracking, ECO / ECN, and supplier qualification.
- Experience working directly with senior engineering leadership or company founders.
Post Time|2026/08/07