Post Time|2024/03/08
The company provides wafer and other service for Tier one companies and other worldwide customers.
Responsibilities|
- Cooperate with all Directly Responsible Individual to ensure the deliver high quality Advanced Packaging product to key North America account.
- Recognize and find out the gaps of customer’s advanced package projects requirements from concept to production, including early stage of technical assessment.
- Cooperate and manage all internal stakeholders to drive and conduct customer product development and production ramp on schedule.
- Handle and monitor project proactively, including planning, execution, managing with internal teams.
- Make sure process goes smoothly and collaborate among organizations, e.g., development phase to ramp/production.
- Clarify customer’s requests and act as the focal point of customer’s contact.
- Prepare and host customer meetings, visits, and follow up.
- Escalate issues that may impact overall program plan.
Requirements|
- With 10 years+ of experience in semiconductor packaging.
- Specialized in advanced packaging.
- Fluent in English and Chinese is a must.
- Proven capabilities in project management and cross-team communication
- A team player with empathy, proactiveness, sense of ownership and growth mindset is preferred
Benefits|
- Attractive Salary Package
- Better annual leave than required.