Summary
A global specialty chemicals and technology solutions provider serving the electronics and semiconductor industries.
Responsibilities
- Develop, implement, and optimize plating processes to meet customer requirements and improve process performance.
- Conduct laboratory experiments and process evaluations at the Tech Center to support product development, qualification, and new application opportunities.
- Provide on-site technical support and troubleshoot process-related issues at customer facilities.
- Collaborate with global R&D, Applications, and Sales teams to support product launches, customer qualifications, and successful technology deployment.
- Prepare technical reports, document experimental results, and present findings to internal teams and customers.
Requirements
- Bachelor’s or Master’s degree in Chemistry, Chemical Engineering, Materials Science, Surface Technology, or a related field.
- Relevant experience in the electronics industry, preferably in PCB, IC substrate, or advanced packaging applications.
- Knowledge of or strong interest in electrochemical metal deposition, plating processes, or surface treatment technologies.
- Experience in process development, laboratory analysis, troubleshooting, or manufacturing process optimization.
- Strong analytical and problem-solving skills, with the ability to translate technical findings into practical solutions.
- Good command of English and Mandarin, with the ability to communicate effectively with local customers and global teams.
- Self-motivated, structured, and collaborative, with a willingness to travel internationally.
Post Time｜2026/10/29
