FAE

Summary

Our client is a leading global semiconductor manufacturing company driving innovation in advanced packaging. Located overseas, this role focuses on the development, optimization, and high-volume manufacturing (HVM) readiness of cutting-edge electroplating (ECD) processes. This position offers extensive cross-functional collaboration, international exposure, and the opportunity to shape next-generation 2.5D/3D heterogeneous integration technologies. 

Responsibilities

• Process Development: Design, optimize, and qualify electrochemical deposition (ECD) processes for critical architectures including TSV, copper pillars, and fine-pitch RDL. 

• Yield & Defect Engineering: Conduct root-cause failure analysis for plating anomalies and implement sustainable solutions to improve process capability and manufacturing yield. 

• Technology Transfer: Lead the seamless transition of advanced plating recipes and equipment baselines from the R&D phase into High-Volume Manufacturing (HVM). 

• Cross-Functional Collaboration: Partner closely with equipment vendors, chemical suppliers, and integration teams to align on deliverables, ensure process stability, and resolve technical bottlenecks. 

Requirements

• Strong analytical and problem-solving mindset for complex defect analysis and process control. 

• Proactive, highly detail-oriented, and reliable under the pressure of HVM environments. 

• Adaptable and culturally open-minded, with a strong willingness to relocate and thrive in an international setting. 

Post Time｜2026/08/27