Company Overview
Our client is a fast-growing German deep-tech company developing next-generation semiconductor inspection systems based on quantum sensing and magnetic field imaging.
Its technology enables engineers to visualize electrical current inside advanced semiconductor devices and complex 2.5D / 3D packages, supporting chip debugging, failure analysis, and yield improvement. As the business expands across Asia, the company is strengthening its local technical application capability in Taiwan.
Job Summary
The Lead Application Engineer Asia will serve as the key technical expert for customers and distributors across Taiwan, China, Japan, Korea, and Singapore.
This is a highly customer-facing, hands-on individual contributor role combining Application Engineering, Failure Analysis, System Troubleshooting, Technical Training, and Customer Success.
You will help semiconductor customers understand and adopt a new inspection technology, support challenging sample-analysis cases, troubleshoot hardware / firmware / software issues, and translate complex measurement results into practical engineering value.
The role is based in Taiwan with approximately 35% travel across Asia.
Responsibilities
- Provide second-level technical and application support to semiconductor customers and distributors across Asia.
- Support customer sample testing, data analysis, result interpretation, and development of testing strategies for challenging applications.
- Serve as the technical bridge between Asia customers and the global application engineering team.
- Define application-specific success criteria and help customers understand the technical value of the inspection platform.
- Support pre-sales evaluations, product demonstrations, and technical proof-of-concept activities.
- Diagnose complex system-level issues involving hardware, firmware, software, tool configuration, and measurement setup.
- Perform technical troubleshooting and failure analysis on returned chips, boards, or system components.
- Help isolate failures across device, hardware, firmware, software, and test configuration.
- Guide customer engineers on tool configuration, measurement methodology, testing protocols, and result interpretation.
- Identify product improvements and new application requirements based on field experience.
- Work with global R&D and Product teams to communicate customer feedback and support continuous product improvement.
- Develop technical training materials for customers, distributors, Field Service Engineers, and Field Application Engineers.
- Deliver pre-sales and post-sales workshops and technical training sessions.
- Develop key customer users into capable internal “super-users.”
- Represent the company at technical conferences, semiconductor exhibitions, workshops, and customer events.
- Prepare technical reports, customer presentations, troubleshooting summaries, and application documentation.
- Maintain clear communication with regional management and global stakeholders.
Requirements
- Bachelor’s degree or above in Electrical Engineering, Physics, Materials Science, Semiconductor Engineering, or a related technical discipline.
- 7+ years of experience in Application Engineering, Field Application Engineering, Technical Support, Field Service, Failure Analysis, or related roles.
- Experience supporting complex semiconductor, laboratory, inspection, test, or capital equipment.
- Strong troubleshooting capability across hardware, firmware, software, and complete systems.
- Comfortable working directly with semiconductor engineering teams on complex technical issues.
- Ability to clearly explain unfamiliar or highly technical concepts to customers.
- Experience conducting technical training, workshops, or customer demonstrations.
- Strong hands-on problem-solving and analytical capability.
- Professional English communication skills.
- Mandarin Chinese or another relevant Asian language is required.
- Comfortable operating independently without a large local technical team.
- Based in Taiwan or willing to relocate to Taiwan.
- Willingness to travel approximately 35% throughout Asia.
Preferred Qualifications
- Semiconductor Failure Analysis experience.
- Familiarity with advanced packaging including 2.5D / 3D ICs, chiplets, interposers, or heterogeneous integration.
- Experience with semiconductor inspection, metrology, FA, or test equipment.
- Familiarity with SEM, TEM, FIB, X-ray, EMMI, OBIRCH, lock-in thermography, or related FA techniques.
- Understanding of IC current flow, electrical defects, shorts, leakage, and power-distribution failures.
- Experience supporting semiconductor fabs, OSATs, IDMs, or FA laboratories.
- Experience with complex data analysis and measurement-result interpretation.
- Exposure to magnetic-field imaging, quantum sensing, NV-center technology, or related physics is a strong plus.
- Experience working with distributors or channel partners across Asia.
- Previous startup or deep-tech company experience.
Post Time｜2026/10/08
