Summary
Our client is a global technology company developing high-performance networking equipment and server systems for enterprise, cloud, and data center applications.
The Mechanical Engineering Director will lead end-to-end mechanical engineering across networking and server platforms, overseeing Industrial Design, Thermal Engineering, Mechanical Design, and PCB mechanical integration. This role owns mechanical system architecture, platform scalability, and cross-functional integration to ensure products meet performance, reliability, cost, and manufacturability targets.
This position plays a critical role in defining product platforms for switches, routers, servers, and rack-level systems, with strong visibility into long-term roadmap and system architecture decisions.
Responsibilities
- Lead and manage mechanical engineering teams covering ID, Thermal, ME, and PCB mechanical interface functions
- Define mechanical architecture and platform strategy for networking products (switches, routers) and server systems
- Drive cross-discipline integration between industrial design, airflow/thermal design, structural mechanics, and PCB layout constraints
- Own mechanical feasibility reviews including chassis architecture, airflow path, port density, power density, and serviceability
- Oversee thermal-mechanical co-design for high-power systems (ASICs, CPUs, GPUs, PSUs), including heatsinks, vapor chambers, fans, and airflow optimization
- Ensure mechanical designs support front-to-back airflow, hot-swap modules, cable management, and rack-level integration
- Review and approve designs through EVT / DVT / PVT and mass production stages
- Establish mechanical design standards, DFx guidelines, and platform reuse strategies
- Partner closely with EE, SI/PI, FW, Manufacturing, Quality, and Supply Chain teams
- Lead tooling strategy, vendor technical reviews, and mechanical cost optimization
- Drive root cause analysis and resolution for thermal, structural, or assembly-related field issues
- Build and mentor senior technical leaders across mechanical and thermal domains
- Provide executive-level input on product roadmap, platform evolution, and capacity planning
Requirements
- Bachelor’s or Master’s degree in Mechanical Engineering or related discipline
- 12+ years of experience in mechanical engineering for networking, server, or data center hardware
- Proven experience leading multi-discipline teams (ID, Thermal, ME, PCB mechanical integration)
- Strong understanding of server and networking chassis architecture
- Hands-on knowledge of high-power thermal solutions (air cooling, vapor chamber, liquid cooling is a plus)
- Experience coordinating PCB layout constraints, connector alignment, keep-out zones, and mechanical stack-up
- Deep understanding of DFx (DFM, DFA, DFR) and mass production readiness
- Experience working with ODM / EMS partners and tooling suppliers in Asia
- Strong cross-functional leadership and technical decision-making skills
- Professional-level English communication ability
Qualifications
- Experience with data center switches, rack servers, or AI server platforms
- Familiarity with NEBS, shock/vibration, thermal, and reliability requirements
- Experience supporting hyperscaler or enterprise customer requirements
- Background in high-port-density or high-power networking systems
Career Development & Impact
- This role is central to platform-level decision-making for networking and server products.
- You will influence how performance, thermal efficiency, serviceability, and manufacturability are balanced at scale, with direct exposure to business-unit strategy and long-term technology planning.
High performers may progress toward VP-level engineering leadership or CTO-track roles.
Post Time｜2026/01/20
