Summary
A leading multinational corporation (MNC) specializing in high-end cleaning solutions for semiconductor advanced manufacturing, advanced packaging, and SMT, dedicated to providing top-tier chemical products and technical support to world-class foundry clients.
Responsibilities
- Serve as the core technical liaison, proactively engaging with process and integration engineers at Tier-1 clients (e.g., TSMC) to discuss and resolve advanced process pain points using a shared “process and chemical language.”
- Operate within a matrix organization, reporting directly to the R&D global head and the Taiwan lead on technical developments and project progress.
- Accurately translate customer specifications and practical process issues, collaborating closely with the R&D team at the global HQ to ensure cross-border R&D projects align perfectly with client expectations.
- Work cross-functionally with Application Engineers in the early stages of projects, actively participating in frontline cleaning process diagnostics, planning Design of Experiments , and evaluating client-side sample testing.
- Leverage a strong academic background to operate advanced laboratory analytical instruments, conduct failure analysis, and optimize cleaning chemical formulations based on fundamental chemical mechanisms.
Requirements
- Ph.D. degree in Chemistry, Chemical Engineering, Material Science, or a related field, with a solid academic foundation and strong logical deduction capabilities.
- Business-fluent in English ; possess excellent cross-cultural communication skills to independently conduct full-English technical meetings, presentations, and technical writing with the global HQ.
- Proficient in the operation and principles of semiconductor-related analytical instruments, with outstanding capabilities in data interpretation and failure analysis.
- Excellent cross-functional collaboration skills, with the ability to work independently and adapt to a fast-paced, matrix organization environment.
- Familiarity with front-end advanced nodes such as post-etch cleaning, or practical knowledge in advanced packaging and SMT cleaning processes is highly preferred.
Post Time|2026/06/29