Key Account Manager

Summary

A fast-growing technology startup specializing in advanced semiconductor packaging materials and electronic materials. With a strong focus on innovation and global expansion, the company works closely with leading OSATs and semiconductor customers across Asia and international markets. 

Responsibilities

• Develop and manage strategic accounts across Taiwan and overseas markets, building long-term relationships with key stakeholders across Procurement, Process Engineering, Quality and R&D. 

• Drive the customer qualification and commercialization process for advanced packaging materials, including Silver Sinter, Underfill and LCM, from initial sampling and reliability validation through pilot production and mass production. 

• Manage the end-to-end international order fulfillment process, coordinating with internal teams on customs clearance, international logistics and delivery to ensure on-time shipment. 

• Lead commercial negotiations covering pricing, payment terms, exchange rates, delivery schedules and Incoterms, while managing the full order-to-cash process. 

• Monitor market trends, competitor activities, material pricing and emerging semiconductor packaging technologies to identify new business opportunities and provide market insights. 

• Work closely with R&D, CQE and FAE teams to resolve technical and quality issues, support customer audits and drive failure analysis and corrective actions. 

• Identify new projects and emerging packaging applications within key accounts, drive new product introductions and expand the company’s share of wallet. 

Requirements

• Bachelor’s degree or above in Materials Science, Microelectronics, Chemistry, Business or related fields. 

• 5 years or above of B2B Sales/Business Development/Key Account Management experience in semiconductor packaging or electronic materials. 

• Proven track record working with major OSATs or semiconductor customers in Taiwan or overseas, with established customer relationships preferred. 

• Solid understanding of semiconductor packaging materials and customer qualification processes, from sampling and reliability validation to mass production. 

• Experience in international business, including cross-border logistics, trade terms and commercial negotiations. 

• Good English communication skills with strong negotiation, interpersonal and cross-functional collaboration abilities. 

• Experience with Silver Sinter, Underfill, LCM or other advanced packaging materials is a strong plus; willing to travel internationally. 

Post Time｜2026/09/04